Keynote Talk

On-Chip Wireless Interconnect Paradigm

Baris Taskin

College of Engineering, Drexel University

Abstract

On-chip wireless interconnects offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. The on-chip wireless interconnect field is a thriving research frontier, with small (in-package) and large (across server racks) scale innovations. This talk will review the primary focus and the supporting periphery being researched for on-chip wireless interconnects.  For instance, the recent discovery of a through-silicon via antenna (TSV_A) will be highlighted for adaptability to a wide range of packaging medium that includes silicon-interposer based multi-chip packages. Projections of TSV_As indicate up to 40 dB improved signal strength compared to other on-chip antennas, with an insertion loss of 3-5 dB up to a 30 mm distance.

The keynote will also highlight the old and new challenges that lie in the path to prominence, and the striking persistence of these challenges in remaining unsolved, despite the research frontier moving forward. A band of usual suspects, spread over a variety of simulation and measurement based studies, will be put to the test of time. The innovations from physical limitation of on-chip antennas to integration challenges at the system-level will be examined under the spotlight and the hindsight of a couple decades of research.

Biography: Baris Taskin is a Professor at the Electrical and Computer Engineering (ECE) Department at Drexel University, Philadelphia, PA. He received the B.S. degree in ECE from Middle East Technical University (METU), Ankara, Turkey, in 2000, and the M.S. and Ph.D. degrees in ECE from University of Pittsburgh, Pittsburgh, PA, in 2003 and 2005, respectively. His research interests include low-power circuits and systems, resonant clocking, NoCs, HW/SW design space exploration for exascale computing. He is an “A. Richard Newton Award” winner from the ACM SIGDA in 2007, a recipient of the NSF CAREER in 2009, the Distinguished Service Award from ACM SIGDA in 2012, the Young Electrical Engineer of the Year Award from IEEE Philadelphia in 2013 and the Drexel ECE Department's Outstanding Research Award in 2015. His research has been funded by NSF (2009-current), SRC (2013-2016) and Samsung Research (2015-2016), enabling research by 13 former & current Ph.D. students (2 NSF GRFP fellowship recipients) in the Drexel VLSI and Architecture Laboratory (http://vlsi.ece.drexel.edu). Among many other societal, editorial and university activities, he is the Chair of the IEEE Council on Electronic Design Automation (IEEE CEDA) Pennsylvania Chapter, the Chair of the IEEE Circuits and Systems Society’s Technical Committee on VLSI Systems and Applications (IEEE CASS VSA-TC) and the Co-Chair of the ACM Great Lakes Symposium on VLSI (GLSVLSI) in 2019, Washington DC.